Title :
Investigating effect of unfilled underfills on board level solder joint reliability of area array packages under drop test and thermal cycling test
Author :
Ibe, Edward S. ; Loh, Karl I. ; Luan, Jing-En ; Tee, Tong Yan
Author_Institution :
Zymet Inc., East Hanover, NJ
Abstract :
The work reported here explores the effect of underfill encapsulants on drop test and thermal cycle reliability of area array packages, such as BGAs, CSPs, and WL-CSPs. An unfilled underfill was found to provide superior drop test performance. Silica filled underfill, with lower CTE, was found to provide superior thermal cycle performance. However, if the unfilled underfill provides adequate thermal cycle performance, its use yields substantial process benefits
Keywords :
encapsulation; impact testing; reliability; silicon compounds; solders; thermal management (packaging); SiO2; area array packages; board level solder joint reliability; drop test performance; silica filled underfill; thermal cycle performance; thermal cycle reliability; thermal cycling test; underfill encapsulants; unfilled underfills; Assembly; Concrete; Electronic packaging thermal management; Fatigue; Flip chip; Floors; Silicon compounds; Soldering; Testing; Viscosity;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614469
