Title :
Reliability and thermal structure design for CMOS image sensor
Author :
Hsu, Hsiang-Chen ; Lee, Hui-Yu ; Hsu, Yu-Chia ; Fu, Shen-Li ; Yang, Chung-Chi ; Huang, Kuan-Chieh
Author_Institution :
Dept. of Mech. Eng., I-Shou Univ., Tainan
Abstract :
The characteristic of overall structure for CMOS image sensor has been studied in this paper. This paper demonstrates the thermal design for the material of compound, UV glue as well as glass. A three-dimensional solid model of CMOS image sensor based on finite element ANSYS software is developed to predict the thermal strain distributions. It is found that the peak stress in UV glue plays a significant role through the manufacturing process. The predicted thermal strains were based on previous researches with the Moire interferometry experimental scheme. The developed finite element 3D model is compared with the JEDEC standard JESD22-A104 reliability thermal cycle test (TCT). The failure mode trend for both predicted model and TCT experimental result were found to be good agreement. A series of comprehensive parametric studies were conducted in this paper. The design rules for thermal optimization of CMOS image sensor are summarized
Keywords :
CMOS image sensors; adhesives; finite element analysis; integrated circuit reliability; thermal management (packaging); 3D solid model; CMOS image sensor; UV glue; failure mode trend; finite element 3D model; finite element ANSYS software; thermal cycle test; thermal optimization; thermal strain distributions; thermal structure design; CMOS image sensors; Capacitive sensors; Finite element methods; Glass; Interferometry; Manufacturing processes; Predictive models; Semiconductor device modeling; Solid modeling; Thermal stresses;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614474
