Title :
Coarsening processes in the lead-free solder alloy AgCu: theoretical and experimental investigations
Author :
Müller, Wolfgang H. ; Böhme, Thomas
Author_Institution :
Inst. fur Mechanik, Technische Univ. Berlin
Abstract :
Experimental investigations show that the microstructure of solders changes over time. In order to estimate the reliability and the lifetime of microelectronic solder materials it is important to predict the rate of microstructural change. Starting with an experimentally based overview on nucleation, spinodal decomposition as well as subsequent phase growth as observed in (lead-free) microelectronic solder connections this paper concentrates on the mathematical description of these phenomena
Keywords :
copper alloys; nucleation; silver alloys; solders; spinodal decomposition; AgCu; coarsening process; lead-free microelectronic solder connections; lead-free solder alloy; microelectronic solder materials; microstructural change; nucleation; spinodal decomposition; Chemical elements; Copper; Electronics packaging; Environmentally friendly manufacturing techniques; Equations; Heat treatment; Intermetallic; Lead; Microelectronics; Stress;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614475
