• DocumentCode
    1562275
  • Title

    Experimental characterization of flow boiling heat dissipation in a microchannel heat sink with different orientations

  • Author

    Zhang, H.Y. ; Pinjala, D. ; Wong, T.N.

  • Author_Institution
    Inst. of Microelectron., Singapore
  • Volume
    2
  • fYear
    2005
  • Abstract
    Experimental characterization of FC-72 flow boiling in a microchannel heat sink is presented for three different orientations: vertical upflow (VU), vertical downflow (VD) and horizontal flow with horizontal facing (HH). The heat sink consisted of 21 microchannels in parallel, with the channel dimensions of 0.2mm (W) times 2mm (H) times 15mm (L). The heat sink was attached onto a flip chip BGA package with a thermal grease at the interface to minimize the contact resistance. The experiments were conducted based on a subcooling around 31 degC and inlet thermodynamic equilibrium quality x=-0.4 with varying flow rates and power inputs. Boiling with bubbles was observed at the heat sink outlet even if the exit quality x<0. It was found that the flow boiling regime can be represented by isolated bubble flow, slug flow in the present microchannels. Both the junction to inlet thermal resistances and pressure drops are presented as functions of the power input. The effect of the flow orientations on both thermal and hydraulic performances was examined and discussed
  • Keywords
    ball grid arrays; boiling; bubbles; cooling; flip-chip devices; heat sinks; microchannel flow; multiphase flow; thermal resistance; 0.2 mm; 15 mm; 2 mm; FC-72 flow boiling; contact resistance; flip chip BGA package; heat dissipation; heat sink outlet; horizontal flow; inlet thermal resistances; inlet thermodynamic equilibrium quality; isolated bubble flow; microchannel heat sink; pressure drops; slug flow; thermal grease; vertical downflow; vertical upflow; Aerospace engineering; Heat sinks; Heat transfer; Liquid cooling; Microchannel; Microelectronics; Resistance heating; Space heating; Thermal management; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
  • Conference_Location
    Singapore
  • Print_ISBN
    0-7803-9578-6
  • Type

    conf

  • DOI
    10.1109/EPTC.2005.1614485
  • Filename
    1614485