DocumentCode
1562371
Title
Mechanism of underfill voids formation in flip chip packaging
Author
Goh, E. ; Zhao, X.L. ; Anand, Ashok ; Mui, Y.C. ; Parthasarathy, Srinivasan ; Master, Raj N.
Author_Institution
Adv. Micro Devices (Singapore) Pte Ltd., Singapore
Volume
2
fYear
2005
Abstract
Voids in flip chip packaging of organic land grid array (OLGA) caused by the inclusion of air, other gases and moisture were studied and experiments were designed to understand the cause of void formation. Reactions among the solder mask, flux residue, underfill and solder bump were investigated to understand the mechanism of voids formation during the assembly of the underfill flip chip packages. The results showed that the position and shape of the voids could provide the evidence of root cause. The paper also discusses procedures to eliminate the said voids
Keywords
ball grid arrays; flip-chip devices; solders; voids (solid); OLGA; flip chip packaging; flux residue; organic land grid array; solder bump; solder mask; underfill flip chip packages; underfill voids formation; Assembly; Bonding; Curing; Flip chip; Integrated circuit packaging; Lead; Manufacturing; Moisture; Packaging machines; Plastic packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location
Singapore
Print_ISBN
0-7803-9578-6
Type
conf
DOI
10.1109/EPTC.2005.1614495
Filename
1614495
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