Title :
Fabrication of thermoelectric cooler for device integration
Author :
Tan, Y.M. ; Fan, W. ; Chua, K.M. ; Shi, Peter Z F ; Wong, C.K.
Author_Institution :
Singapore Inst. of Manuf. Technol.
Abstract :
Thermoelectric cooler (TEC) is a solid state heat pump which uses the semiconductor materials, by Peltier effect, to provide instantaneous cooling or heating. It has the advantage of having no moving parts and thus maintenance free. Due to flexibility in design and miniaturization, there is an opportunity for TEC to be integrated into a temperature sensitive device like laser diodes for temperature stabilization. A TEC module with dimension of 3mm times 3.8mm times 1mm which could fit into a transceiver optical sub-assembly (TOSA) device was demonstrated using conventional dicing and SMT process. The TEC module assembled with 18 pairs of elements of 0.3mm times 0.3mm times 0.4mm is able to achieve a figure-of-merit (Z) of 2.3. The TEC module was also tested extensively in thermal stress test, temperature storage test and power cycling test. All tests showed a stable performance with change in AC resistance of less than 5%
Keywords :
Peltier effect; assembling; cooling; heat pumps; surface mount technology; thermal stability; thermoelectric devices; 0.3 mm; 0.4 mm; 1 mm; 3 mm; 3.8 mm; Peltier effect; SMT process; TEC module; TOSA device; device integration; dicing process; power cycling test; semiconductor materials; solid state heat pump; temperature sensitive device; temperature stabilization; temperature storage test; thermal stress test; thermoelectric cooler; transceiver optical sub-assembly device; Fabrication; Heat pumps; Optical devices; Semiconductor materials; Solid state circuits; Temperature sensors; Testing; Thermal stresses; Thermoelectric devices; Thermoelectricity;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614508
