The more accurate method to extract dielectric constant and loss tangent of insulated material on microwave frequencies

In order to evaluate electrical performance of different packages, various transmission lines are designed on electrical test board. The real transmission line characteristic is affected by several factors, including electromagnetic interference (EMI) issues and embedded section issues. The methods of shielding vias and de-embedded sections for eliminating these two kinds of factors are demonstrated in this paper. Besides, the properties of material are important for evaluating IC packaging performance in design stage. Accurate properties of material provide the correct insight into electrical characteristic of package by simulation technique. In this paper, real dielectric constant and loss tangent of dielectric material is extracted by using strip-line structure on test board. Agilent´s Advanced Design System is used to validate mentioned formulas. Finally, we derive the dielectric constant and loss tangent of ABF by stripline structure of build-up substrate