Impact of fatigue modeling on 2/sup nd/ level joint reliability of BGA packages with SnAgCu solder balls

Author

Stoeckl, Stephan ; Yeo, Alfred ; Lee, Charles ; Pape, Heinz

Author_Institution

Corp. Assembly & Test, Infineon Technol. AG, Regensburg

Volume

2

fYear

2005

Abstract

This paper compares the application of different constitutive material and fatigue models for lead-free (SnAg4.0Cu0.5) solder proposed by Schubert, Wiese, Dudek and Syed. The application of these models is demonstrated and results are compared with the experimental findings for different type of ball grid array packages, which are subjected to a controlled temperature cycling condition. In addition, a semi-empirical approach was used to fit the finite element modeling results with experimental temperature cycling test data for 2^nd level solder joint fatigue failures

Keywords

ball grid arrays; copper alloys; fatigue; finite element analysis; reliability; silver alloys; solders; thermal management (packaging); tin alloys; BGA packages; SnAgCu; SnAgCu solder balls; ball grid array packages; fatigue model; finite element model; lead-free solder; second level joint reliability; solder joint fatigue failures; temperature cycling condition; temperature cycling test data; Capacitive sensors; Creep; Electronic packaging thermal management; Electronics packaging; Fatigue; Neodymium; Steady-state; Stress; Temperature; Thermal loading;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th

Conference_Location

Singapore

Print_ISBN

0-7803-9578-6

Type

conf

DOI

10.1109/EPTC.2005.1614519

Filename

1614519