DocumentCode :
1562964
Title :
Determination of thermophysical properties of thin films for photovoltaic applications
Author :
Wolf, A. ; Pohl, P. ; Brendel, R.
Author_Institution :
Institut fur Solarenergieforschung Hameln, Germany
fYear :
2005
Firstpage :
1749
Lastpage :
1752
Abstract :
The thermophysical properties of thin film materials used for photovoltaic applications are investigated. The measurement procedure that we apply is described in detail. The method is based on a contact-free thermal analysis of free standing thin films using a lock-in thermography system. A laser heat source induces a thermal wave that propagates within the sample. An infrared camera images the wave. From the resulting temperature amplitude and phase images of the wave, the in-plane thermal diffusivity, thermal conductivity, and volumetric heat capacity are deduced. The investigated samples are compound and laminating foils employed in photovoltaic (PV) module encapsulation, as well as a plastic substrate used for thin film solar cell production. The measurement results show large differences in the thermal conductivity of different types of compound materials.
Keywords :
solar cells; specific heat; substrates; thermal analysis; thermal diffusivity; thermophotovoltaic cells; thin films; compound materials; contact-free thermal analysis; infrared camera; inplane thermal diffusivity; laminating foils; laser heat source; photovoltaic module encapsulation; plastic substrate; thermal conductivity; thermophysical properties; thin film materials; thin film solar cell production; volumetric heat capacity; Cameras; Infrared imaging; Optical materials; Optical propagation; Photothermal effects; Photovoltaic systems; Solar power generation; Temperature; Thermal conductivity; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE
ISSN :
0160-8371
Print_ISBN :
0-7803-8707-4
Type :
conf
DOI :
10.1109/PVSC.2005.1488488
Filename :
1488488
Link To Document :
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