DocumentCode
1563687
Title
A silicon condenser microphone with a highly perforated backplate
Author
Bergqvist, J. ; Rudolf, F. ; Maisano, J. ; Parodi, F. ; Ross, M.
Author_Institution
Centre Swisse d´´Electron. et de Microtech., S.A., Neuchatel, Switzerland
fYear
1991
Firstpage
266
Lastpage
269
Abstract
Condenser microphone chips in monocrystalline silicon have been designed and realized with a technology that is well adapted to batch fabrication. The novel design has a thin and highly perforated backplate in combination with an air-gap of 2 mu m. The device has a low bias voltage of 5 V, a frequency response within +or-3 dB from 2 Hz to 20 kHz, and sensitivities in the range of 1 to 2 mV/Pa. Simulations with equivalent acoustical circuits agree well with experimental data up to a frequency of 15 kHz.<>
Keywords
diaphragms; elemental semiconductors; microphones; silicon; 2 Hz to 20 kHz; Si condenser microphone; batch fabrication; elemental semiconductor; equivalent acoustical circuits; frequency response; low bias voltage; perforated backplate; sensitivities; simulation; Air gaps; Capacitance; Capacitive sensors; Damping; Fabrication; Frequency response; Microphones; Silicon; Ventilation; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-87942-585-7
Type
conf
DOI
10.1109/SENSOR.1991.148857
Filename
148857
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