DocumentCode :
1564345
Title :
A system to translate product yield targets to equipment particle targets
Author :
Inani, Anand ; Fang, Hua ; Stine, Brian
Author_Institution :
PDF Solutions, Inc., San Jose, CA
fYear :
2008
Firstpage :
72
Lastpage :
75
Abstract :
Random defectivity reduction is an important prerequisite to achieving mature production yields. The typical technology roadmap includes a product yield / defect density reduction curve over the technology lifetime. Translating the defect density reduction curve into specific monthly targets for each individual module or for each single tool, has proven to be an extremely challenging task. This paper summarizes a proposed method to translate overall technology or product yield targets into corresponding defect density targets allocated to each tool. Achieving this task requires extensive characterization and modeling. This method was eventually used at a fab running 130 nm 6 metal layer copper process.
Keywords :
inspection; production equipment; semiconductor device manufacture; defect density reduction; defect density targets allocation; equipment particle targets; metal layer copper process; random defectivity reduction; technology lifetime; translate product yield targets; Copper; Feature extraction; Inspection; Investments; Manufacturing processes; Neodymium; Particle production; Poles and towers; Production systems; Semiconductor device manufacture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI
Conference_Location :
Cambridge, MA
ISSN :
1078-8743
Print_ISBN :
978-1-4244-1964-7
Electronic_ISBN :
1078-8743
Type :
conf
DOI :
10.1109/ASMC.2008.4529012
Filename :
4529012
Link To Document :
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