DocumentCode :
1564610
Title :
Improved Capabilities for the 372M and 472 Polishing Platforms
Author :
Basak, S. ; Karlsrud, C. ; Leaf, K.
Author_Institution :
Novellus Syst., Inc., Tempe, AZ
fYear :
2008
Firstpage :
136
Lastpage :
137
Abstract :
Large numbers of IPEC 372M and 472 polishers are in service at numerous fabs, R&D labs, and other CMP facilities around the globe. These tools were one of the market-dominant platforms during the initial adoption and growth phase of CMP in the late 1990´s, and are still viable for many applications. However, these tools were produced at a time when fabs used very little factory automation. Many fabs are now pushing the envelope of as-designed performance in an effort to leverage continued use of their fully depreciated asset base for the production of advanced technologies. The key challenges these customers face are typically factory automation capability, pad conditioning consistency, process stability and improved wafer metrics out to 3mm edge exclusion.
Keywords :
chemical mechanical polishing; factory automation; chemical mechanical polishing; edge exclusion; factory automation; wafer metrics; Control systems; Costs; Manufacturing automation; Manufacturing processes; Operating systems; Packaging; Pressure control; Production; Software systems; Stability; CMP; IPEC; control; polisher; upgrade;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI
Conference_Location :
Cambridge, MA
ISSN :
1078-8743
Print_ISBN :
978-1-4244-1964-7
Electronic_ISBN :
1078-8743
Type :
conf
DOI :
10.1109/ASMC.2008.4529040
Filename :
4529040
Link To Document :
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