• DocumentCode
    1564655
  • Title

    Effect of Reduced Equipment Downtime Variability on Cycle Time in a Conventional 300mm Fab

  • Author

    Babbs, Daniel ; Gaskins, Robert

  • Author_Institution
    Brooks Autom. Inc., Chelmsford, MA
  • fYear
    2008
  • Firstpage
    237
  • Lastpage
    242
  • Abstract
    The semiconductor industry is pursuing further cycle time and cost reductions through an initiative termed 300 mm Prime. One key area of focus is improving process tool availability. Equipment downtime-particularly unscheduled down time due to a failure-causes disruptions to production, loss of productivity, and higher costs. This paper focuses on fab productivity improvements resulting from the reduction of tool downtime variability. Preventive maintenance can reduce the risk of unscheduled downtime. Discrete-event simulation is used to investigate the relationship between downtime variability and overall cycle time in a conventional 300 mm fab with batch tools. Variance reduction is modeled by reducing the standard deviation of the time to repair a failed tool and by increasing the portion of tool downtime reserved for regularly scheduled preventive maintenance. Also, the effect of reserving capacity in the form of additional tools is assessed and compared to the effect of reduced downtime variability.
  • Keywords
    discrete event simulation; semiconductor device manufacture; cost reductions; cycle time reductions; discrete-event simulation; fab productivity; reduced equipment downtime variability; semiconductor industry; Automation; Costs; Discrete event simulation; Electronics industry; Job shop scheduling; Preventive maintenance; Production; Productivity; Semiconductor device manufacture; Throughput; 300mm; 300mm Prime; cycle time reduction; discrete-event simulation; preventive maintenance; small-lot manufacturing; tool downtime; variance reduction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI
  • Conference_Location
    Cambridge, MA
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-1964-7
  • Electronic_ISBN
    1078-8743
  • Type

    conf

  • DOI
    10.1109/ASMC.2008.4529045
  • Filename
    4529045