DocumentCode
1564751
Title
TXRF Applications Supporting Yield Enhancements and Tool Monitor-ing in Order to Improve the Front-End Semiconductor Processing
Author
Budri, Thanas
Author_Institution
Nat. Semicond., Portland, ME
fYear
2008
Firstpage
292
Lastpage
296
Abstract
In this paper, we summarize how the introduction of in-line TXRF monitoring provides detailed analytical information on aluminum, titanium and molybdenum contamination levels in order to improve several process steps from front- end processing, minimize product yield loss and make it possible to successfully manufacture multiple products and process geometries in the same fabrication platform.
Keywords
aluminium; fluorescence; integrated circuit manufacture; molybdenum; process monitoring; titanium; TXRF applications; aluminum; fabrication platform; front-end semiconductor processing; molybdenum contamination; product yield loss; titanium; tool monitoring; total reflection X-ray fluorescence; yield enhancements; Aluminum; Contamination; Fabrication; Information analysis; Information geometry; Manufacturing processes; Monitoring; Pulp manufacturing; Semiconductor device manufacture; Titanium; Contamination; SIMS; TXRF; ToF-SIMS;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI
Conference_Location
Cambridge, MA
ISSN
1078-8743
Print_ISBN
978-1-4244-1964-7
Electronic_ISBN
1078-8743
Type
conf
DOI
10.1109/ASMC.2008.4529056
Filename
4529056
Link To Document