Extension of antenna rules for reducing P2ID in 0.13 Cu dual damascene technology

This paper reports the new findings between plasma-charging damage and device surroundings. Antenna design rule has been widely used in semiconductor industry to decrease the plasma charging damage. It is found that even when circuit layout satisfies the antenna design rules, plasma-charging damage may still occur. Macro and micro pattern density are found to have an impact on plasma process induced damage (P2ID) on the device. Macro pattern density is related to the mask transmission ratio, while micro pattern density is related to the conductive structures surrounding the device.