DocumentCode
1565002
Title
In Line Wafer Mapping TXRF Analysis Supporting Process Improvements and Process Development
Author
Budri, Thanas ; Drizlikh, Sergei ; McCulloh, Heather
Author_Institution
Nat. Semicond., Portland, ME
fYear
2008
Firstpage
402
Lastpage
403
Abstract
Wafer mapping TXRF is used as a process optimization tool in metal etch, silicon nitride deposition and chemical mechanical polish.
Keywords
X-ray fluorescence analysis; chemical mechanical polishing; etching; chemical mechanical polish; metal etch; process development; process optimization tool; silicon nitride deposition; total reflective X-ray fluorescence; wafer mapping TXRF analysis; Chemical analysis; Corrosion; Etching; Monitoring; Optical films; Probes; Semiconductor device manufacture; Strips; Surface contamination; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI
Conference_Location
Cambridge, MA
ISSN
1078-8743
Print_ISBN
978-1-4244-1964-7
Electronic_ISBN
1078-8743
Type
conf
DOI
10.1109/ASMC.2008.4529080
Filename
4529080
Link To Document