Title :
In Line Wafer Mapping TXRF Analysis Supporting Process Improvements and Process Development
Author :
Budri, Thanas ; Drizlikh, Sergei ; McCulloh, Heather
Author_Institution :
Nat. Semicond., Portland, ME
Abstract :
Wafer mapping TXRF is used as a process optimization tool in metal etch, silicon nitride deposition and chemical mechanical polish.
Keywords :
X-ray fluorescence analysis; chemical mechanical polishing; etching; chemical mechanical polish; metal etch; process development; process optimization tool; silicon nitride deposition; total reflective X-ray fluorescence; wafer mapping TXRF analysis; Chemical analysis; Corrosion; Etching; Monitoring; Optical films; Probes; Semiconductor device manufacture; Strips; Surface contamination; Tin;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI
Conference_Location :
Cambridge, MA
Print_ISBN :
978-1-4244-1964-7
Electronic_ISBN :
1078-8743
DOI :
10.1109/ASMC.2008.4529080
