Title :
An instruction throughput model of superscalar processors
Author :
Taha, Tarek M. ; Wills, D. Scott
Author_Institution :
Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
Abstract :
With advances in semiconductor technology, processors are becoming larger and more complex. Future processor designers will face an enormous design space, and must evaluate more architecture design points to reach a final optimum design. This exploration is currently performed using cycle accurate simulators that are accurate but slow, limiting a comprehensive search of design options. The vast design space and time to market economic pressures motivate the need for faster architectural evaluation methods. The model presented in this paper facilitates a rapid exploration of the architecture design space for superscalar processors. It supplements current design tools by narrowing a large design space quickly, after which existing cycle accurate simulators can arrive at a precise optimum design. This allows the designer to select the final architecture design much faster than with traditional tools. The model calculates the instruction throughput of superscalar processors using a set of key architecture and application properties. It was validated with a Simplescalar out-of-order simulator. Results were within 5.5% accuracy of the cycle accurate simulator, but executed 40,000 times faster.
Keywords :
computer architecture; performance evaluation; virtual machines; Simplescalar out-of-order simulator; architectural evaluation; architecture design evaluation; cycle accurate simulator; design tools; instruction throughput model; optimum design; processor design space; semiconductor technology; superscalar processors; time to market economic pressure; Buildings; Computer architecture; Current supplies; Microarchitecture; Out of order; Process design; Space technology; Throughput; Thumb; Time to market;
Conference_Titel :
Rapid Systems Prototyping, 2003. Proceedings. 14th IEEE International Workshop on
Print_ISBN :
0-7695-1943-1
DOI :
10.1109/IWRSP.2003.1207043