DocumentCode
156626
Title
C3Map and ARPSO based mapping algorithms for energy-efficient regular 3-D NoC architectures
Author
Bhardwaj, Kshitij ; Mane, Pravin S.
Author_Institution
Goa Campus, Electr. & Electron. Eng., BITS Pilani, Zuarinagar, India
fYear
2014
fDate
28-30 April 2014
Firstpage
1
Lastpage
4
Abstract
Mapping of Intellectual Property (IP) cores onto Network-on-Chip (NoC) architectures is a key step in NoC-based designs. Energy, bandwidth, and latency are the key parameters that need to be optimized in such designs. In this paper, we propose Centralized 3-D Mapping (C3Map) using a new octahedral traversal technique and Attractive-Repulsive Particle Swarm Optimization (ARPSO) based algorithms for mapping IP cores onto 3-D NoC architectures. These algorithms efficiently and accurately explore the multi-objective NoC design space. We formulate the IP mapping as minimization of a cost function in order to obtain Pareto optimal IP mappings. We also propose hybridization of ARPSO with known deterministic techniques. We evaluate the proposed C3Map and ARPSO based hybrid algorithms for real-life applications and E3S benchmarks. The experimental results demonstrate the efficiency and effectiveness of C3Map as we achieved significant reduction in communication energy and latency, i.e. 19.51% to 25.81% and 24.15% to 31.21% respectively w.r.t. the known techniques.
Keywords
Pareto optimisation; industrial property; low-power electronics; network-on-chip; particle swarm optimisation; ARPSO; C3Map; Pareto optimal IP mappings; attractive-repulsive particle swarm optimization; centralized 3D mapping; communication energy reduction; cost function; energy efficient regular 3D NoC architectures; intellectual property cores; mapping algorithms; multiobjective NoC design space; network-on-chip; octahedral traversal technique; Algorithm design and analysis; Benchmark testing; Delays; IP networks; Particle swarm optimization; Spirals; Tiles;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, Automation and Test (VLSI-DAT), 2014 International Symposium on
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/VLSI-DAT.2014.6834909
Filename
6834909
Link To Document