• DocumentCode
    1567041
  • Title

    Design of a novel elliptical skin biopsy punch device

  • Author

    Weiner, David ; Wainwright, Matthew ; Tacvorian, Edward ; Hall, Derek ; Gaudette, Glenn ; Dunn, Raymond

  • Author_Institution
    Dept. of Biomed. Eng., Worcester Polytech. Inst., Worcester, MA
  • fYear
    2009
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Current skin biopsy techniques utilizing a punch biopsy device can leave raised scars that are cosmetically unappealing. With 3.8 million procedures per year, the potential marketability of a superior device is substantial. The goal of this study is to design a novel elliptical punch biopsy device that maintains the simplicity of existing products while minimizing scarring. Mechanical testing was performed on porcine skin to determine the force required to breach the dermal layer using a single #11 scalpel blade (comparable to the excision biopsy technique), the traditional biopsy punch, and a novel blade design. The force required to penetrate the skin using the novel design (81.72 N) prototype was considerably higher than the single #11 blade (1.89 N-2.42 N) as well as the punch biopsy (4.61 N). Initial force data and mathematical analysis has resulted in a final blade design that requires less force than the initial prototype and includes fail-safes to prevent excessive depth of penetration. Clinicians will ultimately test these devices, and their feedback will be used to create a final production design. Finally, a proposed mass manufacturing technique was created.
  • Keywords
    biomedical equipment; mechanical testing; prototypes; punching; skin; blade design; design prototype; elliptical skin biopsy punch device; mass manufacturing technique; mathematical analysis; mechanical testing; porcine skin; scalpel blade; Biopsy; Blades; Dermis; Feedback; Mathematical analysis; Performance evaluation; Production; Prototypes; Skin; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bioengineering Conference, 2009 IEEE 35th Annual Northeast
  • Conference_Location
    Boston, MA
  • Print_ISBN
    978-1-4244-4362-8
  • Electronic_ISBN
    978-1-4244-4364-2
  • Type

    conf

  • DOI
    10.1109/NEBC.2009.4967666
  • Filename
    4967666