Advanced silicon-on-silicon VLSI multichip packaging

A multichip module (MCM) packaging technology was developed for commercial and military applications based on the VLSI chips on silicon (VCOS) technology. This VCOS technology is extremely well suited for low-power, high-density CMOS applications where low cost and fast design cycles are critical. With the use of IBM´s controlled collapse chip connection (C4), this technology can basically brick-wall good VLSI chips on the VCOS interconnecting substrate, thus achieving wafer-scale integration densities with 100% circuit yield. A special burn-in substrate can be used to burn-in and then test chips before mounting to the MCM, thus improving the final MCM assembly yield. This technology has been used in several military and commercial applications for both internal and external IBM programs. The VCOS technology is currently undergoing the certification and qualification of the Qualified Manufacturer Listing the US Department of Defense applications such as in the Advanced Spaceborne Computer Module program