Title :
Surface micromachined structures fabricated with silicon fusion bonding
Author :
Petersen, K. ; Gee, D. ; Pourahmade, F. ; Craddock, R. ; Brown, J. ; Christel, L.
Abstract :
A surface micromachining technique has been developed which makes use of silicon fusion bonding. Many of the same types of micromechanical devices previously fabricated from polycrystalline have been fabricated from single-crystal silicon. Bridges and beams suspended near the substrate surface, complex thermally isolated designs, diaphragms suspended over shallow vacuum cavities, vertically and laterally resonant structures, fluid control devices, and fully released components have been created. It is concluded that this novel surface micromachining process is a powerful and versatile technology for a new generation of micromechanical inventions.<>
Keywords :
elemental semiconductors; etching; integrated circuit technology; micromechanical devices; semiconductor technology; silicon; Si; beams; bridges; diaphragms; etching; fluid control; fusion bonding; laterally resonant structures; micromechanical devices; surface micromachining; thermally isolated designs; vertically resonant structures; Etching; Fabrication; Micromachining; Micromechanical devices; Piezoresistance; Resistors; Resonance; Silicon; Substrates; Wafer bonding;
Conference_Titel :
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-87942-585-7
DOI :
10.1109/SENSOR.1991.148895