Title :
Technical issues with multichip module packaging
Author :
McWilliams, Bruce ; Demmin, Jeffrey
Author_Institution :
nCHIP Inc., San Jose, CA, USA
Abstract :
It is asserted that multichip modules (MCMs) provide a solution to the requirement for cost-effective high-performance packaging in the 1990s, and insight into the selection of an optimum interconnect technology is provided. The different types of interconnect substrates for MCMs are discussed, and it is argued that cofired ceramic and thin-film interconnect substrates are the most suitable ones for use in applications requiring high interconnect density. The issues associated with packaging MCMs are also discussed in detail, with emphasis placed on current implementations. Finally, an application of thin-film MCM technology being produced by nCHIP is reviewed
Keywords :
hybrid integrated circuits; multichip modules; cofired ceramic substates; cost-effective high-performance packaging; multichip module packaging; optimum interconnect technology; package design; thin-film MCM technology; thin-film interconnect substrates; Application software; CMOS technology; Costs; Integrated circuit interconnections; Integrated circuit packaging; Microprocessors; Multichip modules; Packaging machines; Pins; Transistors;
Conference_Titel :
Telesystems Conference, 1992. NTC-92., National
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0554-X
DOI :
10.1109/NTC.1992.267914
