• DocumentCode
    1568308
  • Title

    TLM automation for multi-core design

  • Author

    Abdi, Samar

  • Author_Institution
    Electr. & Comput. Eng., Concordia Univ., Montreal, QC, Canada
  • fYear
    2010
  • Firstpage
    717
  • Lastpage
    724
  • Abstract
    Transaction Level Models (TLMs) are being increasingly used by multi-core system designers for design validation and embedded SW development. However, with well defined modeling semantics and TLM automation tools, it is also possible to use TLMs for multi-core design. This paper presents recent research in automatic generation of timed TLMs for early, yet reliable, evaluation of multi-core design decisions. The TLMs are automatically generated from a given mapping of a concurrent application to a multi-core platform. The application code is annotated with delays at the basic-block level of granularity. Similarly, the platform services, such as communication and scheduling, also include timing delays. The TLM automation methods have been implemented in the embedded system environment (ESE) toolset. Our experimental results with ESE demonstrate that multi-core TLMs can be generated in the order of seconds; they simulate close to host-compiled application execution speed, and are more than 90% accurate compared to board measurements on average for industrial size examples. Therefore, TLM automation enables early and reliable evaluation of multi-core design decisions.
  • Keywords
    embedded systems; logic design; microprocessor chips; TLM automation tools; design validation; embedded system environment toolset; embedded systems; host-compiled application execution speed; multicore system designer; scheduling; transaction level models; Delay; Design automation; Design engineering; Design methodology; Embedded computing; Embedded system; Hardware; Job shop scheduling; Prototypes; Software prototyping;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2010 15th Asia and South Pacific
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-5765-6
  • Electronic_ISBN
    978-1-4244-5767-0
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2010.5419793
  • Filename
    5419793