• DocumentCode
    1568985
  • Title

    Buffered clock tree sizing for skew minimization under power and thermal budgets

  • Author

    Athikulwongse, Krit ; Zhao, Xin ; Lim, Sung Kyu

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2010
  • Firstpage
    474
  • Lastpage
    479
  • Abstract
    In this paper, we study the clock tree sizing problem for thermal-aware skew minimization under power and thermal budgets. Clock wire/buffer sizing affects not only the delay/skew, but also the power dissipation of the clock tree. This effect in turn triggers changes in thermal distribution, making re-computation of the delay/skew necessary. Thus, the interaction among skew, power, and temperature is highly complicated if tied with clock wire/buffer sizing. In order to efficiently combat the time-varying nature of underlying thermal profile, we focus on two kinds of skew, depending on the number of thermal profiles given: skew value and skew range. The former refers to the skew value computed under a single steady-state thermal profile, whereas the latter refers to the skew range computed based on multiple thermal profiles. Our thermal-aware sequential-linear-programming approach maintains near-zero skew value and narrow skew range while keeping the power dissipation and temperature under the given budgets.
  • Keywords
    circuit optimisation; clocks; integrated circuit design; linear programming; buffered clock tree sizing; multiple thermal profiles; power budgets; power dissipation; sequential-linear-programming; thermal budgets; thermal distribution; thermal-aware skew minimization; Clocks; Conductivity; Delay; Power dissipation; Power system reliability; Steady-state; Temperature distribution; Thermal engineering; Very large scale integration; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2010 15th Asia and South Pacific
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-5765-6
  • Electronic_ISBN
    978-1-4244-5767-0
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2010.5419835
  • Filename
    5419835