• DocumentCode
    1569159
  • Title

    Correlating system test fmax with structural test fmax and process monitoring measurements

  • Author

    Chen, Janine ; Zeng, Jing ; Wang, Li C. ; Mateja, Michael

  • Author_Institution
    Dept. of ECE, Univ. of California - Santa Barbara, Santa Barbara, CA, USA
  • fYear
    2010
  • Firstpage
    419
  • Lastpage
    424
  • Abstract
    System test has been the standard measurement to evaluate performance variability of high-performance microprocessors. The question of whether or not many of the lower-cost alternative tests can be used to reduce system test has been studied for many years. This paper utilizes a data-learning approach for correlating three test datasets, structural test, ring oscillator test, and scan flush test, with system test. With the data-learning approach, higher correlation can be found without altering test measurements or test conditions. Rather, the approach utilizes new optimization algorithms to extract more useful information in the three test datasets, with particular success using the structural test data. To further minimize test cost, process monitoring measurements (ring oscillator and scan flush tests) are used to reduce the need for high-frequency structural test. We demonstrate our methodology on a recent high-performance microprocessor design.
  • Keywords
    circuit testing; microprocessor chips; oscillators; process monitoring; correlating system test; data-learning approach; high-performance microprocessors; lower-cost alternative tests; performance variability; process monitoring measurements; ring oscillator test; scan flush test; structural test; Data mining; Delay; Flip-flops; Frequency measurement; Measurement standards; Microprocessors; Monitoring; Ring oscillators; Semiconductor device measurement; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2010 15th Asia and South Pacific
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-5765-6
  • Electronic_ISBN
    978-1-4244-5767-0
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2010.5419846
  • Filename
    5419846