• DocumentCode
    1569297
  • Title

    TSPC-DICE: A single phase clock high performance SEU hardened flip-flop

  • Author

    Jahinuzzaman, Shah M. ; Islam, Riadul

  • Author_Institution
    Electr. & Comput. Eng., Concordia Univ., Montreal, QC, Canada
  • fYear
    2010
  • Firstpage
    73
  • Lastpage
    76
  • Abstract
    This paper presents a true single-phase clock (TSPC) flip-flop that is robust against radiation-induced single event upsets (SEUs) or soft errors. The flip-flop consists of an input stage that uses a single phase clock to pass the data to a storage unit at the positive edge of the clock. The single phase clock enables designing power-efficient and easily-routed clock-tree and reducing the NBTI effect on the setup and hold times. The storage unit consists of the SEU robust dual interlocked cell (DICE), which has four nodes that replicate the data bit and its complement for recovering from a single event transient (SET). Two nodes with the same logic value inside the storage unit drive a C-element at the output. The C-element masks the propagation of any SET from the internal nodes of the storage unit to the output. The proposed flip-flop consists of only 22 transistors, consumes smaller area, and exhibits as much as 12% lower power-delay product when compared with a recently reported SEU robust flip-flop implemented in a commercial 65nm CMOS technology.
  • Keywords
    CMOS integrated circuits; flip-flops; logic design; radiation effects; C-element; CMOS technology; SEU robust dual interlocked cell; TSPC-DICE; radiation-induced single event upset; single event transient; single phase clock flip-flop; size 65 nm; soft error; CMOS technology; Circuits; Clocks; Flip-flops; Latches; Logic; Microprocessors; Neutrons; Robustness; Single event upset; Cosmic radiation; fault tolerance; flip-flop; single event upset;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (MWSCAS), 2010 53rd IEEE International Midwest Symposium on
  • Conference_Location
    Seattle, WA
  • ISSN
    1548-3746
  • Print_ISBN
    978-1-4244-7771-5
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2010.5548564
  • Filename
    5548564