DocumentCode :
1569570
Title :
Mechanical evaluation of topical silicone gel on skin wound healing
Author :
Chiang, C.H. ; Yang, C.S. ; Yeh, C.H. ; Chen, M.Y. ; Su, F.C. ; Liu, C.Y. ; Chen, C.Y. ; Yeh, M.L.
Author_Institution :
Inst. of Biomed. Eng., Nat. Cheng Kung Univ., Tainan
fYear :
2009
Firstpage :
1
Lastpage :
2
Abstract :
Dermatix is a Food and Drug Administration (FDA) registered treatment for hypertrophic scars and keloids. Some studies have evaluated its effects on scars and tried to find out its mechanism of effectiveness. However, there were few papers discussing about the mechanical properties of wounds after treated with Dermatix. Thus, our study aims to conduct tensile test to analyze the condition of skin wound treated with Dermatix and compare the results to the non-treated wounds. We evaluated the wound healing condition at 1, 2, 4 and 6 weeks healing time and introduced recovery index to normalize the different growing condition of each rats. The results showed that during healing time 4~6 weeks, both wounds recovered rapidly. And in all the healing time, Dermatix treated group showed better tensile strength and better recovery index. However, no significant difference was found at all healing time. We guess it is occlusion, hydration and normalization of TEWL effects of Dermatix that help collagen synthesize.
Keywords :
biomechanics; biomedical materials; drugs; gelatin; patient treatment; silicones; skin; tensile strength; Dermatix; Food and Drug Administration; TEWL effects; healing time; hydration; hypertrophic scars; keloids; normalization; occlusion; recovery index; skin wound healing; tensile strength; tensile test; topical silicone gel; Biomedical engineering; Drugs; Hospitals; Mechanical factors; Medical treatment; Rats; Shape measurement; Skin; System testing; Wounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bioengineering Conference, 2009 IEEE 35th Annual Northeast
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-4362-8
Electronic_ISBN :
978-1-4244-4364-2
Type :
conf
DOI :
10.1109/NEBC.2009.4967834
Filename :
4967834
Link To Document :
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