Title :
Transfer of carbon nanotubes onto microactuators for hysteresis-free transistors at low thermal budget
Author :
Muoth, M. ; Hierold, C.
Author_Institution :
Dept. of Mech. & Process Eng., ETH Zurich, Zurich, Switzerland
Abstract :
A dry transfer process for single-walled carbon nanotubes allows for suspended, ultraclean, and hysteresis-free nanotube field-effect transistors on micro-actuated electrodes without exposing the device die to elevated nanotube growth temperatures. Nanotubes are grown on a separate die, between the arms of a fork structure, and are subsequently transferred onto receiving electrodes of a device die. The device die is maintained at room-temperature; and thus, it can in principle contain temperature-sensitive readout circuitry. The liquid-free, room-temperature transfer is performed under light microscopy observation, while placement is detected by monitoring the current through the device electrodes. In contrast to manipulation under electron beam observation, electron-beam-induced carbonaceous contamination is prevented. Moreover, pre-selection of nanotubes by Raman spectroscopy is rendered possible, avoiding any contamination of the nanomaterial during selection and integration into NEMS.
Keywords :
carbon nanotubes; field effect transistors; microactuators; nanotube devices; Raman spectroscopy; device die; device electrodes; dry transfer process; electron beam observation; electron-beam-induced carbonaceous contamination; fork structure; hysteresis-free nanotube field-effect transistors; hysteresis-free transistors; light microscopy observation; low thermal budget; micro-actuated electrodes; microactuators; nanomaterial; nanotube growth temperature; principle contain temperature-sensitive readout circuitry; room-temperature transfer; separate die; single-walled carbon nanotubes; suspended; ultraclean; CNTFETs; Carbon nanotubes; Electrodes; Logic gates; Nanoscale devices; Substrates;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2012 IEEE 25th International Conference on
Conference_Location :
Paris
Print_ISBN :
978-1-4673-0324-8
DOI :
10.1109/MEMSYS.2012.6170417