What kinds of SOI wafers are suitable for what micromachining purposes?

Author

Kanda, Y.

Author_Institution

Hamamatsu Univ., Sch. of Med., Japan

fYear

1991

Firstpage

452

Lastpage

455

Abstract

SIMOX (separation by implanted oxygen), ZMR (zone melting recrystallization), and bonded SOI wafers are compared from the viewpoint of applications to sensors and actuators (S&A). These are whole wafers scale SOIs. Other local SOI technologies are discussed. It is noted that SOI wafers are especially attractive for smart power S&A, as each component is dielectrically isolated. Mobile elements such as diaphragm, cantilever, bridge, rotor, and valve can be fabricated by single-crystal silicon.<>

Keywords

diaphragms; electric actuators; electric sensing devices; elemental semiconductors; integrated circuit technology; ion implantation; micromechanical devices; recrystallisation; semiconductor technology; semiconductor-insulator boundaries; silicon; SIMOX; SOI wafers; Si-SiO/sub 2/; actuators; bonded wafers; bridge; cantilever; diaphragm; dielectrically isolated; elemental semiconductors; micromachining; mobile elements; rotor; sensors; single crystal Si; smart power; valve; whole wafers scale; zone melting recrystallization; Annealing; CMOS technology; Etching; Intelligent sensors; Isolation technology; Micromachining; Silicon on insulator technology; Temperature sensors; Thermal expansion; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on

Conference_Location

San Francisco, CA, USA

Print_ISBN

0-87942-585-7

Type

conf

DOI

10.1109/SENSOR.1991.148909

Filename

148909