Improvement on chip-level electrothermal simulator-ILLIADS-T

Author

Cheng, Yi-Kan ; Rosenbaum, Elyse ; Kang, Sung-Mo

Author_Institution

Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA

Volume

4

fYear

1996

Firstpage

432

Abstract

In this paper, improvements on the previously developed chip-level electrothermal simulator, ILLIADS-T, are presented. The improved version (ILLIADS-T2) enhances the efficiency during uncoupled electrothermal simulations by taking advantage of the potential latency of circuit blocks. The generalized variable-grid system for numerically simulating heat flow in composite materials is also developed and presented

Keywords

CMOS integrated circuits; VLSI; circuit analysis computing; finite difference methods; integrated circuit layout; integrated circuit reliability; temperature distribution; CMOS VLSI; ILLIADS-T; ILLIADS-T2; chip-level electrothermal simulator; circuit block latency; composite materials; efficiency enhancement; finite difference simulator; generalized variable-grid system; heat flow; numerical simulation; steady state temperature distribution; uncoupled electrothermal simulations; Circuit optimization; Circuit simulation; Composite materials; Computational modeling; Delay; Electrothermal effects; MOS devices; Power generation; Steady-state; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 1996. ISCAS '96., Connecting the World., 1996 IEEE International Symposium on

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-3073-0

Type

conf

DOI

10.1109/ISCAS.1996.541994

Filename

541994