Title :
Nonvolatile CBRAM-Crossbar-Based 3-D-Integrated Hybrid Memory for Data Retention
Author :
Yuhao Wang ; Hao Yu ; Wei Zhang
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
Abstract :
This paper explores the design of 3-D-integrated hybrid memory by conductive-bridge random-access-memory (CBRAM). Considering internal states, height, and radius of the conductive bridge of one CBRAM device, an accurate CBRAM device model is developed for CBRAM-crossbar-based nonvolatile memory design with efficient estimation of area, access time, and power. Based on this design platform, one 3-D-integrated hybrid memory is designed by stacking one tier of CBRAMcrossbar with tiers of static random access memory (SRAM) and dynamic random access memory (DRAM), where the tier of CBRAM-crossbar is deployed for data retention during power gating of SRAM/DRAM tiers. One corresponding block-level data retention is developed to only write back dirty data from SRAM/DRAM to CBRAM-crossbar. When compared with phase-change random-access-memory-based system-level data retention, our design achieves 11× faster data-migration speed and 10× less data-migration power. When compared with ferroelectric random-access-memory-based bit-level data retention, our design also achieves 17× smaller area and 56× smaller power under the same data-migration speed.
Keywords :
DRAM chips; SRAM chips; integrated circuit design; three-dimensional integrated circuits; CBRAM device model; DRAM; SRAM; block-level data retention; conductive-bridge random-access-memory; dynamic random access memory; ferroelectric random-access-memory-based bit-level data retention; nonvolatile CBRAM-crossbar-based 3D-integrated hybrid memory design; phase-change random-access-memory; power gating; static random access memory; system-level data retention; 3-D hybrid memory; conductive-bridge RAM (CBRAM); data retention; nonvolatile memory; power gating; power gating.;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2013.2265754