Title :
An analytical lumped-parameter 3D cochlear model and architecture for cochlear signal processing in VLSI
Author :
Machado, Gerson A S ; Toumazou, Chris
Author_Institution :
Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
Abstract :
Design considerations for a neuromorphic cochlear implant and its system architecture are given. A set of equations describing a fully continuous complete (3-turn) analytical 3D lumped-parameter (LP) impedance model based on in-vivo guinea-pig cochleae measurements and qualitative reasoning is introduced. 3D phase and amplitude in the organ of corti (OC) can be visualised from a stimulus presented at the round window (RW) for normal and implanted cochleae. A SPICE model uses nonlinear longitudinal resistors and linear (transversal) Rs and Cs which can be easily made amplitude and/or freq. dependent. The methodology is used in devising a new non-linear, multi-functional cochlear architecture to aid the synthesis of circuit building blocks representing sensory transduction. Further model applications include realistic and computationally efficient studies of electrode stimulation issues in implanted cochleae, and frequency-domain mapping of compressive and expansive OC nonlinearities for future silicon VLSI closed-loop cochlear implants or speech recognition
Keywords :
SPICE; VLSI; biomedical electronics; hearing aids; integrated circuit modelling; lumped parameter networks; medical signal processing; SPICE; circuit synthesis; closed-loop system; electrode stimulation; frequency-domain mapping; guinea pig; lumped-parameter 3D model; neuromorphic cochlear implant; nonlinear multifunctional architecture; organ of corti; qualitative reasoning; round window; sensory transduction; signal processing; silicon VLSI design; speech recognition; Cochlear implants; Computer architecture; Equations; Impedance measurement; Neuromorphics; Phase measurement; Resistors; SPICE; Visualization; Windows;
Conference_Titel :
Circuits and Systems, 1996. ISCAS '96., Connecting the World., 1996 IEEE International Symposium on
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-3073-0
DOI :
10.1109/ISCAS.1996.542008