Title :
Temperature dependent resistance of exchange biased spin valves with extremely thin IrMn
Author :
Stern, N.P. ; Barton, A.E. ; Sparks, P.D. ; Carey, M.J. ; Eckert, J.C.
Author_Institution :
Dept. of Phys., Harvey Mudd Coll., Claremont, CA, USA
Abstract :
Summary form only given. The properties of IrMn spin valves with IrMn layer thicknesses ranging from 4 /spl Aring/ to 28 /spl Aring/ are explored at temperatures to 5 K. In particular, the temperature dependence of the resistance is investigated. The structure of the spin valves is: Si/50 /spl Aring/ Ti/40 /spl Aring/ NiFe/8 /spl Aring/ Co/30 /spl Aring/ Cu/30 /spl Aring/ Co/t/sub IrMn//50 /spl Aring/ Ti. The low temperature GMR is not greatly affected by the thickness of the IrMn. The thinner the IrMn, the lower the temperature at which the GMR is adversely affected. This is consistent with a reduction in the blocking temperature. A number of interesting features in the coercivity and field training are IrMn thickness dependent. The exchange field, coercive field, GMR and resistance each show characteristic temperatures. All of these and the blocking temperature depend on t/sub IrMn/. Because the temperature dependence of the magnetic fields in these samples is so complicated we examine the directly measured resistance as a function of temperature.
Keywords :
coercive force; electrical resistivity; exchange interactions (electron); giant magnetoresistance; iridium alloys; manganese alloys; spin valves; 4 to 28 A; 5 K; GMR; IrMn; Si-Ti-NiFe-Co-Cu-Co-IrMn-Ti; Si/Ti/NiFe/Co/Cu/Co/IrMn/Ti; blocking temperature; characteristic temperature; coercive field; coercivity; exchange biased spin valves; exchange field; field training; layer thickness dependence; resistance; temperature dependence; Annealing; Coercive force; Educational institutions; Electrical resistance measurement; Magnetic field measurement; Physics; Sparks; Spin valves; Temperature dependence; Temperature distribution;
Conference_Titel :
Magnetics Conference, 2002. INTERMAG Europe 2002. Digest of Technical Papers. 2002 IEEE International
Conference_Location :
Amsterdam, The Netherlands
Print_ISBN :
0-7803-7365-0
DOI :
10.1109/INTMAG.2002.1001232