DocumentCode
1571503
Title
An analytical delay reduction strategy for buffer-inserted global interconnects in VDSM technologies
Author
Zangeneh, Mahmoud ; Masoumi, Nasser
Author_Institution
Adv. VLSI Lab., Univ. of Tehran, Tehran, Iran
fYear
2009
Firstpage
470
Lastpage
475
Abstract
This paper presents innovative closed-form expressions for the propagation delay of buffer-inserted resistive-capacitive global interconnects. These expressions optimize the delay as a function of number of line segments, buffer ratios and line width. Precise simulations have been used to verify the formulation as well as the relationship between each expression. There exists less than 7% error between the derived formulation and the simulation results. Moreover, the authors have used interleaved buffer insertion technique to minimize the effects of crosstalk on the variation of the propagation delay. The new formulation over the interleaved buffer insertion has been simulated using HSPICE to verify the methodology.
Keywords
SPICE; buffer circuits; crosstalk; delay circuits; integrated circuit interconnections; HSPICE; VDSM technologies; analytical delay reduction strategy; buffer-inserted global interconnects; crosstalk effects; innovative closed form expressions; interleaved buffer insertion; propagation delay; very deep submicron; Circuit simulation; Closed-form solution; Computational modeling; Crosstalk; Integrated circuit interconnections; Propagation delay; Repeaters; Signal design; Very large scale integration; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuit Theory and Design, 2009. ECCTD 2009. European Conference on
Conference_Location
Antalya
Print_ISBN
978-1-4244-3896-9
Electronic_ISBN
978-1-4244-3896-9
Type
conf
DOI
10.1109/ECCTD.2009.5275036
Filename
5275036
Link To Document