• DocumentCode
    1571503
  • Title

    An analytical delay reduction strategy for buffer-inserted global interconnects in VDSM technologies

  • Author

    Zangeneh, Mahmoud ; Masoumi, Nasser

  • Author_Institution
    Adv. VLSI Lab., Univ. of Tehran, Tehran, Iran
  • fYear
    2009
  • Firstpage
    470
  • Lastpage
    475
  • Abstract
    This paper presents innovative closed-form expressions for the propagation delay of buffer-inserted resistive-capacitive global interconnects. These expressions optimize the delay as a function of number of line segments, buffer ratios and line width. Precise simulations have been used to verify the formulation as well as the relationship between each expression. There exists less than 7% error between the derived formulation and the simulation results. Moreover, the authors have used interleaved buffer insertion technique to minimize the effects of crosstalk on the variation of the propagation delay. The new formulation over the interleaved buffer insertion has been simulated using HSPICE to verify the methodology.
  • Keywords
    SPICE; buffer circuits; crosstalk; delay circuits; integrated circuit interconnections; HSPICE; VDSM technologies; analytical delay reduction strategy; buffer-inserted global interconnects; crosstalk effects; innovative closed form expressions; interleaved buffer insertion; propagation delay; very deep submicron; Circuit simulation; Closed-form solution; Computational modeling; Crosstalk; Integrated circuit interconnections; Propagation delay; Repeaters; Signal design; Very large scale integration; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuit Theory and Design, 2009. ECCTD 2009. European Conference on
  • Conference_Location
    Antalya
  • Print_ISBN
    978-1-4244-3896-9
  • Electronic_ISBN
    978-1-4244-3896-9
  • Type

    conf

  • DOI
    10.1109/ECCTD.2009.5275036
  • Filename
    5275036