Terabus: Chip-to-chip board-level optical data buses

Author

Kash, J.A. ; Doany, F.E. ; Schow, C.L. ; Budd, R. ; Baks, C. ; Kuchta, D.M. ; Pepeljugoski, P. ; Schares, L. ; Dangel, R. ; Horst, F. ; Offrein, B.J. ; Tsang, C. ; Ruiz, N. ; Patel, C. ; Horton, R. ; Libsch, F. ; Knickerbocker, J.U.

Author_Institution

IBM Res. Div., T. J. Watson Res. Lab., Yorktown Heights, NY

fYear

2008

Firstpage

515

Lastpage

516

Abstract

Optical interconnects using polymer waveguides on circuit boards have been demonstrated. Wirebond-free ultradense transceivers provide 160 Gb/s bidirectional throughput with 16 parallel waveguide-connected transmitters and receivers. Initial designs use 985 nm VCSELs. Migration to the industry-standard 850 nm VCSEL wavelength is underway, also providing lower waveguide loss.

Keywords

integrated optics; integrated optoelectronics; laser cavity resonators; optical interconnections; optical losses; optical polymers; optical receivers; optical transmitters; optical waveguides; semiconductor lasers; surface emitting lasers; transceivers; Terabus; VCSEL; bit rate 160 Gbit/s; board-level optical data buses; chip-to-chip optical data buses; circuit boards; optical interconnects; parallel waveguide-connected receivers; parallel waveguide-connected transmitters; polymer waveguides; ultradense transceivers; waveguide loss; wavelength 850 nm; wavelength 985 nm; wirebond-free transceivers; Data buses; Optical interconnections; Optical polymers; Optical receivers; Optical transmitters; Optical waveguides; Printed circuits; Throughput; Transceivers; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

IEEE Lasers and Electro-Optics Society, 2008. LEOS 2008. 21st Annual Meeting of the

Conference_Location

Acapulco

Print_ISBN

978-1-4244-1931-9

Electronic_ISBN

978-1-4244-1932-6

Type

conf

DOI

10.1109/LEOS.2008.4688718

Filename

4688718