• DocumentCode
    1572124
  • Title

    Review of optical interconnect(on board or others) development in Japan

  • Author

    Kurata, Kazuhiko

  • Author_Institution
    NEC Corp., Kawasaki
  • fYear
    2008
  • Firstpage
    517
  • Lastpage
    518
  • Abstract
    Activity in development of optical interconnection is growing in Japan. In this review recent Japanese activities are outlined from an opto-electronics package point of view. The most advantage in optical interconnection is in optical wiring such as an optical fiber or optical waveguide. The first motive for optical interconnection is realization of high throughput data transmission beyond speed of electrical transmission. The data throughput of a back plane in routers and servers is well over Tbps. This requires data transmission rates exceeding 10 Gbps . At high bit rates problems in electrical connections begins to appear. The most important problems are in design of input/output (I/O) buffers and in the characteristics of electric parts such as a printed wiring board (PWB) and interposer. To overcome the limitation of electrical connection realization of optical interconnection is expected for high speed transmission. Optical interconnection is considered one of the best solutions to realize low power consumption for high data transmission. On the other hand, additional components like optical transceivers and optical connectors are necessary. These components have to be merged in the circuit board without sacrificing board space or the total manufacturing cost.
  • Keywords
    data communication; integrated optoelectronics; optical interconnections; optical waveguides; printed circuits; Japan; data transmission; electrical connections; input/output buffers; optical connectors; optical fiber; optical interconnection development; optical transceivers; optical waveguide; optical wiring; opto-electronics package; printed wiring board; Data communication; High speed optical techniques; Integrated circuit interconnections; Optical buffering; Optical devices; Optical interconnections; Optical waveguides; Packaging; Throughput; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IEEE Lasers and Electro-Optics Society, 2008. LEOS 2008. 21st Annual Meeting of the
  • Conference_Location
    Acapulco
  • Print_ISBN
    978-1-4244-1931-9
  • Electronic_ISBN
    978-1-4244-1932-6
  • Type

    conf

  • DOI
    10.1109/LEOS.2008.4688719
  • Filename
    4688719