Title :
Direct cooled modules - integrated heat sinks
Author :
Hohlfeld, Olaf ; Herbrandt, Alexander
Author_Institution :
Infineon Technol. AG, Warstein, Germany
Abstract :
Various cooling structures suitable for integrated water cooling including pin fin, folded and bonded structures have been compared. A jointing method has been presented, that allows the reliable mounting of substrates onto aluminium structures. A demonstrator with a cooling structure was manufactured and its reliability was tested.
Keywords :
cooling; heat sinks; reliability; aluminium structures; bonded structures; cooling structures; direct cooled modules; folded structures; integrated heat sinks; integrated water cooling; pin fin; reliability; reliable mounting; substrates; Assembly; Cooling; Copper; Substrates; Thermal resistance; Wires;
Conference_Titel :
Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on
Conference_Location :
Nuremberg
Print_ISBN :
978-3-8007-3414-6
