Title :
Reliability of Planar SKiN Interconnect Technology
Author :
Scheuermann, Uwe
Author_Institution :
SEMIKRON Elektron. GmbH & Co. KG, Nuremberg, Germany
Abstract :
The classical module design is limited in lifetime by solder interfaces and wire bond technology. The elimination of the traditional base plate and the replacement of solder interfaces by a high reliable Ag sinter technology led to the first 100% solder free module. The SKiN technology eliminates the last obstacle to a significant lifetime and reliability improvement: the wire bonds. It additionally replaces the interface to the heat sink by an Ag sinter interconnect and thus allows a very compact and light design of power electronic systems.
Keywords :
integrated circuit interconnections; integrated circuit reliability; lead bonding; power electronics; solders; Ag sinter interconnect; classical module design; planar SKiN interconnect technology; power electronic systems; reliability improvement; solder interfaces; wire bond technology; wire bonds; Degradation; Insulated gate bipolar transistors; Materials; Multichip modules; Reliability; Skin; Wires;
Conference_Titel :
Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on
Conference_Location :
Nuremberg
Print_ISBN :
978-3-8007-3414-6
