• DocumentCode
    1573568
  • Title

    Gain-enhanced LTCC system-on-package for automotive UMRR applications

  • Author

    Ghaffar, F.A. ; Khalid, M.U. ; Shamim, A. ; Salama, K.N.

  • Author_Institution
    Electr. Eng. Program, King Abdullah Univ. of Sci. & Technol. (KAUST), Thuwal, Saudi Arabia
  • fYear
    2010
  • Firstpage
    934
  • Lastpage
    937
  • Abstract
    A novel Low Temperature Co-fired Ceramic (LTCC) based SoP for automotive radar applications is presented. For the first time a combination of a relatively low dielectric constant LTCC substrate and a high dielectric constant LTCC superstrate has been incorporated to enhance the overall gain of the module. The superstrate can provide additional protection to the integrated circuits (IC) in the harsh automotive environment. A custom cavity in the LTCC substrate can accommodate the IC, which feeds an aperture coupled patch antenna array. The cavity is embedded below the ground plane that acts as a shield for the IC from antenna radiation. It is estimated that with mere 10 dBm of transmitted RF power the miniature SoP module (sized 2.0 cm × 2.0 cm × 0.22 cm) can communicate up to 67 m. The design´s compactness, robustness, transmission power and resultant communication range are highly suitable for Universal Medium Range Radar (UMRR) applications.
  • Keywords
    antenna radiation patterns; aperture antennas; ceramic packaging; integrated circuits; microstrip antenna arrays; permittivity; road vehicle radar; antenna radiation; aperture coupled patch antenna array; automotive UMRR applications; automotive radar applications; dielectric constant; gain-enhanced LTCC system-on-package; integrated circuits; low temperature co-fired ceramic; universal medium range radar; Apertures; Automotive engineering; Ceramics; Dielectric constant; Dielectric substrates; Feeds; High-K gate dielectrics; Protection; Radar applications; Temperature; Low Temperature Co-fired Ceramic (LTCC); System on Package (SoP); Universal Medium Short Range Radar (UMRR);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (MWSCAS), 2010 53rd IEEE International Midwest Symposium on
  • Conference_Location
    Seattle, WA
  • ISSN
    1548-3746
  • Print_ISBN
    978-1-4244-7771-5
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2010.5548783
  • Filename
    5548783