• DocumentCode
    1573753
  • Title

    Compressively strained InSb MOSFETs with high hole mobility for p-channel application

  • Author

    Barth, Matthew ; Agrawal, Ankit ; Ali, Ahmad ; Fastenau, J. ; Loubychev, Dmitri ; Liu, W.K. ; Datta, Soupayan

  • Author_Institution
    Pennsylvania State Univ., University Park, PA, USA
  • fYear
    2013
  • Firstpage
    21
  • Lastpage
    22
  • Abstract
    We demonstrate synthesis of p-channel InSb MOSFET with 1.9% compressive biaxial strain with outstanding room temperature and 150K Hall mobility of 680 cm2/Vs and 2,500 cm2/Vs at hole sheet density of 5x1012 /cm2 and 2.3x1012 /cm2, respectively. The incorporation of an InP layer on top of Al0.35In0.65Sb barrier allows for integration of a high-k dielectric and demonstration of InSb pMOSFET with significantly reduced gate leakage. Parallel conduction limits the on-off ratio of the InSb MOSFET above 150K. Refinement of the InP barrier to reduce interface states and buffer layer to reduce parallel conduction is expected to improve InSb pMOSFET characteristics at 300K.
  • Keywords
    III-V semiconductors; MOSFET; high-k dielectric thin films; hole mobility; indium compounds; InSb; compressive biaxial strain; compressively strained MOSFET; gate leakage; high hole mobility; high-k dielectric; hole sheet density; on-off ratio; p-channel application; parallel conduction limits; temperature 293 K to 298 K; temperature 300 K; Aluminum oxide; Indium phosphide; Logic gates; MOSFET; Plasma temperature; Temperature; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference (DRC), 2013 71st Annual
  • Conference_Location
    Notre Dame, IN
  • ISSN
    1548-3770
  • Print_ISBN
    978-1-4799-0811-0
  • Type

    conf

  • DOI
    10.1109/DRC.2013.6633775
  • Filename
    6633775