Title :
Mixed-Signal and Smart-Power Capable Hybrid Structured ASIC for Cost-Aware Single-Chip Integration of Industrial Applications
Author :
Zhang, Yipin ; Scherjon, Cor ; Burghartz, Joachim N.
Author_Institution :
CHIPS, Inst. for Microelectron. Stuttgart, Stuttgart, Germany
Abstract :
A new single-chip integration approach for industrial applications based on novel mixed-signal and smart-power capable hybrid structured ASIC is presented. The hybrid structured ASIC, offering low non-recurring engineering (NRE) costs of low-voltage (LV) structured ASICs as well as power electronic functionalities of cell based smart-power ICs, provides a cost-efficient integration platform for industrial applications. Based on the demonstrator chip fabricated in a 0.8micrometer high-voltage (HV) bipolar, CMOS, DMOS (BCD) silicon on insulator (SOI) process, construction of the hybrid structured ASIC is illustrated in detail and the applicability of the platform is successfully demonstrated.
Keywords :
CMOS integrated circuits; application specific integrated circuits; power integrated circuits; silicon-on-insulator; CMOS; DMOS; NRE; SOI process; cost-aware single-chip integration; high-voltage bipolar; industrial applications; mixed-signal hybrid structured ASIC; nonrecurring engineering; power electronic functionalities; silicon on insulator; smart-power IC; smart-power capable hybrid structured ASIC; Application specific integrated circuits; Field programmable gate arrays; Metallization; Periodic structures; Regulators; Resistors; Voltage control;
Conference_Titel :
Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on
Conference_Location :
Nuremberg
Print_ISBN :
978-3-8007-3414-6
