Title :
Evaluation of silver-sintering die attach
Author :
Sabbah, W. ; Riva, R. ; Hascoët, S. ; Buttay, C. ; Azzopardi, S. ; Woirgard, E. ; Planson, D. ; Allard, B. ; Meuret, R.
Author_Institution :
Safran Group, Hispano-Suiza, Réau, France
Abstract :
Silver sintering die attach is a promising technology for high temperature power electronics packaging. In this paper, we evaluate its performances in terms of thermal resistance and high temperature stability. The thermal resistance is measured on test vehicles assembled under different conditions, using silver pastes from NBETech and Heraeus, with different process parameters. The stability test is performed by storing samples at an elevated temperature (300°C) in air, with a strong voltage bias (1100 V) for several hours.
Keywords :
electronics packaging; power electronics; silver; sintering; thermal resistance; high temperature power electronics packaging; performance evaluation; silver paste; silver-sintering die attach evaluation; stability test; temperature 300 C; temperature stability; test vehicle; thermal resistance; voltage 1100 V; Current measurement; Electrical resistance measurement; Junctions; Silver; Temperature measurement; Thermal resistance; Vehicles;
Conference_Titel :
Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on
Conference_Location :
Nuremberg
Print_ISBN :
978-3-8007-3414-6
