• DocumentCode
    1574202
  • Title

    Evaluation of silver-sintering die attach

  • Author

    Sabbah, W. ; Riva, R. ; Hascoët, S. ; Buttay, C. ; Azzopardi, S. ; Woirgard, E. ; Planson, D. ; Allard, B. ; Meuret, R.

  • Author_Institution
    Safran Group, Hispano-Suiza, Réau, France
  • fYear
    2012
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Silver sintering die attach is a promising technology for high temperature power electronics packaging. In this paper, we evaluate its performances in terms of thermal resistance and high temperature stability. The thermal resistance is measured on test vehicles assembled under different conditions, using silver pastes from NBETech and Heraeus, with different process parameters. The stability test is performed by storing samples at an elevated temperature (300°C) in air, with a strong voltage bias (1100 V) for several hours.
  • Keywords
    electronics packaging; power electronics; silver; sintering; thermal resistance; high temperature power electronics packaging; performance evaluation; silver paste; silver-sintering die attach evaluation; stability test; temperature 300 C; temperature stability; test vehicle; thermal resistance; voltage 1100 V; Current measurement; Electrical resistance measurement; Junctions; Silver; Temperature measurement; Thermal resistance; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on
  • Conference_Location
    Nuremberg
  • Print_ISBN
    978-3-8007-3414-6
  • Type

    conf

  • Filename
    6170693
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1574202