DocumentCode :
1576126
Title :
The design of a bi-directional, RFID-based ASIC for interfacing with SPI bus peripherals
Author :
Turner, Matthew ; Naber, John
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Louisville, Louisville, KY, USA
fYear :
2010
Firstpage :
554
Lastpage :
557
Abstract :
The design of a mixed-signal Integrated Circuit (IC) for data logging and wireless telemetry applications is presented. The 3.3mm × 3.3mm IC is integrated into a RFID transponder along with a MEMS pressure sensor and FRAM memory. The sensor and memory ICs are independently addressable via the serial peripheral interface (SPI) standard. The IC was designed for fabrication using a 0.5-μm CMOS process and implements a RF front-end, SPI Master and digital Finite State Machine (FSM). The wireless front-end operates via a 13.56MHz inductive coupled system for power transfer and bi-directional data transmission to a reader and has on-chip voltage-regulation, data recovery, and load modulation circuits. The digital logic implements a custom developed wireless SPI protocol, allowing for direct communication with SPI peripherals via the RF front-end. Additionally, a digital FSM is responsible for data logging operation, in which pressure data is autonomously measured and stored in memory over constant intervals. Test results are presented for an independently fabricated digital circuit consisting of 4,014 equivalent 2-input NOR gates with a measured current consumption of 12μA at Vdd=2.8V and FCLK=140kHz.
Keywords :
CMOS integrated circuits; finite state machines; micromechanical devices; mixed analogue-digital integrated circuits; peripheral interfaces; radiofrequency identification; telemetry; transponders; CMOS process; FRAM memory; MEMS pressure sensor; RFID transponder; SPI bus peripherals; SPI standard; bi-directional RFID-based ASIC; bi-directional data transmission; data logging; data recovery; digital finite state machine; digital logic; frequency 13.56 MHz; load modulation circuit; memory IC; mixed-signal integrated circuit; on-chip voltage-regulation; power transfer; sensor IC; serial peripheral interface; size 0.5 mum; size 3.3 mm; wireless SPI protocol; wireless front-end; wireless telemetry; Application specific integrated circuits; Bidirectional control; Circuit testing; Micromechanical devices; Mixed analog digital integrated circuits; Radio frequency; Radiofrequency identification; Telemetry; Transponders; Wireless sensor networks;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (MWSCAS), 2010 53rd IEEE International Midwest Symposium on
Conference_Location :
Seattle, WA
ISSN :
1548-3746
Print_ISBN :
978-1-4244-7771-5
Type :
conf
DOI :
10.1109/MWSCAS.2010.5548886
Filename :
5548886
Link To Document :
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