• DocumentCode
    1576807
  • Title

    Depletion-mode Ga2O3 MOSFETs

  • Author

    Higashiwaki, Masataka ; Sasaki, Kazuhiko ; Kamimura, Taeko ; Wong, Man Hoi ; Krishnamurthy, Dheepak ; Kuramata, Akito ; Masui, Takekazu ; Yamakoshi, Shigenobu

  • Author_Institution
    Nat. Inst. of Inf. & Commun. Technol. (NICT), Koganei, Japan
  • fYear
    2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We have been proposing a new oxide compound semiconductor, gallium oxide (Ga2O3), as a promising candidate for power device applications because of its excellent material properties and suitability for mass production. The 4.8-eV bandgap and the Baliga´s figure of merit of Ga2O3 are much larger than those of SiC and GaN, which will enable Ga2O3 power devices with higher breakdown voltage and efficiency than SiC and GaN devices. The other important advantage of Ga2O3 is that a single-crystal bulk can be grown by using the same melt growth method as is used for sapphire. Therefore, Ga2O3 power devices have the obvious potential to surpass SiC and GaN in not only device performance but also cost effectiveness. In this work, we fabricated and demonstrated depletion-mode Ga2O3 metal-oxide-semiconductor field-effect transistors (MOSFETs).
  • Keywords
    gallium compounds; power MOSFET; semiconductor device breakdown; wide band gap semiconductors; Baliga figure of merit; Ga2O3; bandgap; breakdown voltage; depletion-mode Ga2O3 MOSFET; melt growth method; metal-oxide-semiconductor field-effect transistors; oxide compound semiconductor; power devices; single-crystal bulk; Annealing; Gallium nitride; Logic gates; MOSFET; Silicon; Substrates; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference (DRC), 2013 71st Annual
  • Conference_Location
    Notre Dame, IN
  • ISSN
    1548-3770
  • Print_ISBN
    978-1-4799-0811-0
  • Type

    conf

  • DOI
    10.1109/DRC.2013.6633890
  • Filename
    6633890