DocumentCode
1577086
Title
Loop-level Speculative Parallelism in Embedded Applications
Author
Islam, Mafijul Md ; Busck, Alexander ; Engbom, Mikael ; Lee, Simji ; Dubois, Michel ; Stenström, Per
Author_Institution
Dept. of Comput. Sci. & Eng., Chalmers Univ. of Technol., Goteborg
fYear
2007
Firstpage
3
Lastpage
3
Abstract
As multi-core microprocessors are becoming widely adopted, the need to extract thread-level parallelism (TLP) from single-threaded applications in a seamless fashion increases. In this paper, we characterize the nature of TLP in embedded applications and study the limits of performance speedup using parallelizing compilers on platforms with and without support for thread-level speculation. First and somewhat expected, only two out of ten applications from the consumer and telecom domains of the EEMBC suite could be automatically parallelized on multi-core architectures without thread-level speculation (TLS) support. We systematically study the speedup obtained by parallelizing compiler technologies by factoring in the impact of the number of cores, thread decomposition strategies, and thread-management overhead. Overall, we have found that a TLS substrate is critical to uncover thread level parallelism and thread- management overhead must be low. On an eight-way multi-core system, it is possible to achieve a speedup of four, on average, for six out of the ten applications of EEMBC which we have analyzed.
Keywords
embedded systems; multi-threading; parallelising compilers; program control structures; embedded application; loop-level speculative parallelism; multicore microprocessor; parallelizing compiler; thread-level parallelism; Application software; Batteries; Computer science; Energy consumption; Frequency; Information analysis; Microprocessors; Parallel processing; Telecommunications; Yarn;
fLanguage
English
Publisher
ieee
Conference_Titel
Parallel Processing, 2007. ICPP 2007. International Conference on
Conference_Location
Xi´an
ISSN
0190-3918
Print_ISBN
978-0-7695-2933-2
Type
conf
DOI
10.1109/ICPP.2007.53
Filename
4343810
Link To Document