Title :
EMC-driven placement for MCM
Author :
Feng, Wu-Shiung ; Tseng, Yaw-hua
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
In this paper, we use the hierarchical placement algorithm to implement EMC driven MCM placement. To ensure that every maximal connection chip pairs are placed as close as possible, we provide a clustering development algorithm. A proper model for EMC-driven MCM placement is used in this work. By this model, we use a short wire antenna to simulate the radiation of each chip on the substrate. At present, we have implemented an MCM placement program successfully, and this program can output the layout with a CIF form
Keywords :
circuit layout CAD; electromagnetic compatibility; multichip modules; CIF form; EMC-driven placement; MCM; clustering development algorithm; hierarchical placement algorithm; layout; maximal connection chip pairs; radiation; short wire antenna; Multichip modules;
Conference_Titel :
Electromagnetic Compatibility Proceedings, 1997 International Symposium on
Conference_Location :
Beijing
Print_ISBN :
0-7803-3608-9
DOI :
10.1109/ELMAGC.1997.617163
