Title :
A statistical method for reducing systematic defects in the initial stages of production
Author :
Nemoto, Kazunori ; Ikeda, Shuji ; Yoshida, Osamu ; Sasabe, Shunji ; Su, Hua
Author_Institution :
Trecenti Technologies Inc., Ibaraki, Japan
fDate :
6/24/1905 12:00:00 AM
Abstract :
A method is described for reducing systematic defects in the initial stages of production and thereby improving yield. Statistical correlation analysis is used to find the critical process parameters that cause yield loss. Application of the proposed method to actual 300-mm wafer fabrication demonstrated that it does detect the parameters to be modified resulting in yield improvement.
Keywords :
correlation methods; integrated circuit yield; statistical analysis; 300 mm; defect-to-yield correlation; semiconductor wafer fabrication; statistical analysis; systematic defect reduction; yield improvement; Costs; Data analysis; Fabrication; Inspection; Process control; Production systems; Semiconductor device manufacture; Statistical analysis; Switches; Thickness measurement;
Conference_Titel :
Advanced Semiconductor Manufacturing 2002 IEEE/SEMI Conference and Workshop
Print_ISBN :
0-7803-7158-5
DOI :
10.1109/ASMC.2002.1001578
