DocumentCode :
1580801
Title :
Cradle to gate toxic impacts of solders: a comparison of impact assessment methods
Author :
Socolof, Maria Leet ; Geibig, J.R. ; Swanson, Mary B.
Author_Institution :
Center for Clean Products & Clean Technol., Tennessee Univ., Knoxville, TN, USA
fYear :
2003
Firstpage :
66
Lastpage :
71
Abstract :
This paper compares and contrasts two methods for calculating life-cycle human and aquatic toxicity impacts. A hazard value (HV) approach and a toxicity potential (TP) approach are used to calculate toxic impacts of three wave solder alloys: tin/lead (SnPb), tin/copper (SnCu), and tin/silver/copper (SAC). TPs are based on a more sophisticated model than the HV method; however, the TP method is less comprehensive in the number of potentially toxic chemicals it includes. Both methods resulted in similar overall conclusions regarding the relative difference in impacts for each solder alternative; however, the inventory data that drive the impact results differ for the two impact assessment methods.
Keywords :
copper alloys; environmental factors; lead alloys; silver alloys; soldering; tin alloys; SnAgCu; SnCu; SnPb; hazard value; impact assessment methods; inventory data; life-cycle aquatic toxicity impacts; life-cycle human toxicity impacts; potentially toxic chemicals; solders; three wave solder alloys; tin/copper; tin/silver/copper; toxic impacts; toxicity potential; Copper; Data mining; Environmentally friendly manufacturing techniques; Global warming; Humans; Inorganic materials; Lead; Lifting equipment; Manufacturing processes; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics and the Environment, 2003. IEEE International Symposium on
ISSN :
1095-2020
Print_ISBN :
0-7803-7743-5
Type :
conf
DOI :
10.1109/ISEE.2003.1208049
Filename :
1208049
Link To Document :
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