• DocumentCode
    1580801
  • Title

    Cradle to gate toxic impacts of solders: a comparison of impact assessment methods

  • Author

    Socolof, Maria Leet ; Geibig, J.R. ; Swanson, Mary B.

  • Author_Institution
    Center for Clean Products & Clean Technol., Tennessee Univ., Knoxville, TN, USA
  • fYear
    2003
  • Firstpage
    66
  • Lastpage
    71
  • Abstract
    This paper compares and contrasts two methods for calculating life-cycle human and aquatic toxicity impacts. A hazard value (HV) approach and a toxicity potential (TP) approach are used to calculate toxic impacts of three wave solder alloys: tin/lead (SnPb), tin/copper (SnCu), and tin/silver/copper (SAC). TPs are based on a more sophisticated model than the HV method; however, the TP method is less comprehensive in the number of potentially toxic chemicals it includes. Both methods resulted in similar overall conclusions regarding the relative difference in impacts for each solder alternative; however, the inventory data that drive the impact results differ for the two impact assessment methods.
  • Keywords
    copper alloys; environmental factors; lead alloys; silver alloys; soldering; tin alloys; SnAgCu; SnCu; SnPb; hazard value; impact assessment methods; inventory data; life-cycle aquatic toxicity impacts; life-cycle human toxicity impacts; potentially toxic chemicals; solders; three wave solder alloys; tin/copper; tin/silver/copper; toxic impacts; toxicity potential; Copper; Data mining; Environmentally friendly manufacturing techniques; Global warming; Humans; Inorganic materials; Lead; Lifting equipment; Manufacturing processes; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 2003. IEEE International Symposium on
  • ISSN
    1095-2020
  • Print_ISBN
    0-7803-7743-5
  • Type

    conf

  • DOI
    10.1109/ISEE.2003.1208049
  • Filename
    1208049