Title :
High frequency, low cost, power packaging using thin film power overlay technology
Author :
Fisher, R. ; Fillion, R. ; Burgess, J. ; Hennessy, W.
Author_Institution :
Corp. Res. & Dev., Gen. Electr. Co., Schenectady, NY, USA
Abstract :
The improved performance of high power circuits are achieved using an innovative embedded chip MCM technology for power applications. This power package development is based upon an extension of a thin film MCM process which replaces the parasitic limiting wirebonds of hybrid power circuits and the package limiting SMT power circuits with low impedance, multilayer metal interconnects. This paper describes the thin film power overlay technology and how this package structure improves electrical, thermal, and reliability performance
Keywords :
integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; multichip modules; power integrated circuits; thin film circuits; electrical performance improvement; embedded chip MCM technology; high frequency; high power circuits; low impedance; multilayer metal interconnects; power applications; power packaging; reliability performance improvement; thermal performance improvement; thin film power overlay technology; Bridge circuits; Costs; Frequency; Inductance; Integrated circuit interconnections; Packaging; Switches; Thin film circuits; Transistors; Voltage;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 1995. APEC '95. Conference Proceedings 1995., Tenth Annual
Conference_Location :
Dallas, TX
Print_ISBN :
0-7803-2482-X
DOI :
10.1109/APEC.1995.468955
