• DocumentCode
    1581779
  • Title

    Kinect-based 3D video conference system

  • Author

    Dongdong Zhang ; Ye Yao ; Dian Liu ; Yanyu Chen ; Di Zang

  • Author_Institution
    Comput. Sci. Dept., Tongji Univ., Shanghai, China
  • fYear
    2013
  • Firstpage
    165
  • Lastpage
    169
  • Abstract
    In this paper, we proposed a 3D video conference system based on Kinect. In the sending module, a parallel scheme is designed for data acquisition, preprocessing and encoding of color video frames, depth video frames and audio data. A simple color-matching method is introduced for depth optimization to recover the lost depth information. H.264 and MP3 encoder are used to perform data compression. All the encoded data is transmitted to the receiver using the RTP network protocol. The receiving module is responsible for the decoding of video and audio, 3D rendering and video display. We use Depth-Image-Based-Rendering (DIBR) technology to construct one virtual view scene. Then 3D video is generated using the virtual view video and the decompressed color video. Experimental results show that our system can achieve 15f/s real time communication with better 3D quality.
  • Keywords
    data acquisition; data compression; image colour analysis; rendering (computer graphics); teleconferencing; transport protocols; video codecs; video coding; 3D rendering; DIBR technology; H.264 encoder; Kinect-based 3D video conference system; MP3 encoder; RTP network protocol; audio data; audio decoding; color video decompression; color video frame encoding; color video frame preprocessing; color-matching method; data acquisition; data compression; depth optimization; depth video frames; depth-image-based-rendering technology; lost depth information; video decoding; video display; virtual view scene; virtual view video; Encoding; Image color analysis; Optimization; Real-time systems; Rendering (computer graphics); Streaming media; Three-dimensional displays; 3D video conference; DIBR; depth optimization; kinect;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Global High Tech Congress on Electronics (GHTCE), 2013 IEEE
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/GHTCE.2013.6767265
  • Filename
    6767265