DocumentCode :
1581779
Title :
Kinect-based 3D video conference system
Author :
Dongdong Zhang ; Ye Yao ; Dian Liu ; Yanyu Chen ; Di Zang
Author_Institution :
Comput. Sci. Dept., Tongji Univ., Shanghai, China
fYear :
2013
Firstpage :
165
Lastpage :
169
Abstract :
In this paper, we proposed a 3D video conference system based on Kinect. In the sending module, a parallel scheme is designed for data acquisition, preprocessing and encoding of color video frames, depth video frames and audio data. A simple color-matching method is introduced for depth optimization to recover the lost depth information. H.264 and MP3 encoder are used to perform data compression. All the encoded data is transmitted to the receiver using the RTP network protocol. The receiving module is responsible for the decoding of video and audio, 3D rendering and video display. We use Depth-Image-Based-Rendering (DIBR) technology to construct one virtual view scene. Then 3D video is generated using the virtual view video and the decompressed color video. Experimental results show that our system can achieve 15f/s real time communication with better 3D quality.
Keywords :
data acquisition; data compression; image colour analysis; rendering (computer graphics); teleconferencing; transport protocols; video codecs; video coding; 3D rendering; DIBR technology; H.264 encoder; Kinect-based 3D video conference system; MP3 encoder; RTP network protocol; audio data; audio decoding; color video decompression; color video frame encoding; color video frame preprocessing; color-matching method; data acquisition; data compression; depth optimization; depth video frames; depth-image-based-rendering technology; lost depth information; video decoding; video display; virtual view scene; virtual view video; Encoding; Image color analysis; Optimization; Real-time systems; Rendering (computer graphics); Streaming media; Three-dimensional displays; 3D video conference; DIBR; depth optimization; kinect;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Global High Tech Congress on Electronics (GHTCE), 2013 IEEE
Conference_Location :
Shenzhen
Type :
conf
DOI :
10.1109/GHTCE.2013.6767265
Filename :
6767265
Link To Document :
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